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da5535-30c_001.doc march 3rd, 2009 1 000055351474 ecn1199 MS5535-30C (rohs * ) pressure sensor module ? 0 - 30 bar absolute pressure range ? 6 coefficients for software compensation stored on-chip ? piezoresistive silicon micromachined sensor ? integrated miniature pressure sensor 9 x 9 mm ? 16 bit adc ? 3-wire serial interface ? 1 system clock line (32.768 khz) ? low voltage and low power consumption ? rohs-compatible & pb-free* description the MS5535-30C is a high-pressure version of ms5535 c pressure sensor module. it contains a precision piezoresistive pressure sensor and an adc-interface ic. it uses an antimagnetic polished stainless rin g for sealing o-ring. it provides a 16 bit data word from a pressure and temperature dependent voltage. addi tionally the module contains 6 readable coefficients for a h ighly accurate software calibration of the sensor. ms5535- 30c is a low power, low voltage device with automat ic power down (on/off) switching. a 3-wire interfac e is used for all communications with a microcontroller. features applications ? resolution 3.0 mbar ? supply voltage 2.2 v to 3.6 v ? low supply current < 5ua ? standby current < 0.1 ua ? mobile water depth measurement systems ? diving computers and divers watches ? -40c to +125c operation temperature ? 16 bit adc resolution pressure measurement and control systems block diagram vdd gnd mclk sclk dout din input mux adc digital interface memory (prom) 64 bits sensor sgnd +in -in dig. filter sensor interface ic fig. 1: block diagram MS5535-30C. * the european rohs directive 2002/95/ec (r estriction o f the use of certain h azardous s ubstances in electrical and electronic equipment) bans the use of lead, mercury, cadmium, hexavalent chromium and polybrominated biphenyls (pbb) or poly brominated diphenyl ethers (pbde).
da5535-30c_001.doc march 3rd, 2009 2 000055351474 ecn1199 pin configuration fig. 2: pin configuration of MS5535-30C. pin name pin type function gnd 1 g ground sclk 2 i serial data clock dout 3 o data output din 4 i data input mclk 5 i master clock (32.768 khz) vdd 6 p positive supply voltage pen (1) 7 i programming enable pv (1) 8 n negative programming voltage note 1) pin 7 (pen) and pin 8 (pv) are only used by the manufacturer for calibration purposes and should no t be connected. absolute maximum ratings parameter symbol conditions min max unit notes supply voltage vdd ta = 25 o c -0.3 4 v storage temperature t s -40 +125 o c 1 overpressure p ta = 25 o c 50 bar note 1) storage and operation in an environment of dry a nd non-corrosive gases.
da5535-30c_001.doc march 3rd, 2009 3 000055351474 ecn1199 recommended operating conditions (ta = 25c, vdd = 3.0 v unless noted otherwise) parameter symbol conditions min. typ. max unit operating pressure range p 0 30 bar supply voltage vdd 2.2 3.0 3.6 v supply current, average (1) during conversion (2) standby (no conversion) i avg i sc i ss vdd = 3.0 v 4 1 0.1 a ma a current consumption into mclk (3) mclk = 32.768 khz 0.5 a operating temperature range t -40 +125 c conversion time t conv mclk = 32.768 khz 35 ms external clock signal (4) mclk 30.000 32.768 35.00 0 khz duty cycle of mclk 40/60 50/50 60/40 % serial data clock sclk 500 khz notes 1) under the assumption of one conversion every sec ond. conversion means either a pressure or a temperature measurement started by a command to the serial interface of MS5535-30C. 2) during conversion the sensor will be switched on and off in order to reduce power consumption; the total on time within a conversion is about 2 ms. 3) this value can be reduced by switching off mclk while MS5535-30C is in standby mode. 4) it is strongly recommended that a crystal oscill ator be used because the device is sensitive to clo ck jitter. a square-wave form of the clock signal is a must.
da5535-30c_001.doc march 3rd, 2009 4 000055351474 ecn1199 electrical characteristics digital inputs (t = -40c .. 125c, vdd = 2.2 v .. 3.6 v) parameter symbol conditions min typ max unit input high voltage v ih 80% vdd 100% vdd v input low voltage v il 0% vdd 20% vdd v signal rise time t r 200 ns signal fall time t f 200 ns digital outputs (t = -40c .. 125c, vdd = 2.2 v .. 3.6 v) parameter symbol conditions min typ max unit output high voltage v oh i source = 0.6 ma 80% vdd 100% vdd v output low voltage v ol i sink = 0.6 ma 0% vdd 20% vdd v signal rise time t r 200 ns signal fall time t f 200 ns ad-converter (t = -40c .. 125c, vdd = 2.2 v .. 3.6 v) parameter symbol conditions min typ max unit resolution 16 bit linear range 4000 40000 lsb conversion time mclk = 32768 hz 35 ms inl within linear range -5 +5 lsb
da5535-30c_001.doc march 3rd, 2009 5 000055351474 ecn1199 pressure output characteristics with the calibration data stored in the interface i c of the MS5535-30C the following characteristics c an be achieved: (vdd = 3.0 v unless noted otherwise) parameter conditions min typ max unit notes resolution 3.0 mbar 1 absolute pressure accuracy (temperature range 0 .. +40c) p = 0 .. 10 bar p = 0 .. 20 bar p = 0 .. 30 bar -65 -150 -375 +50 +50 +50 mbar 2 absolute pressure accuracy (temperature range -40 .. +85c) p = 0 .. 10 bar p = 0 .. 20 bar p = 0 .. 30 bar -100 -150 -400 +250 +450 +500 mbar 2 absolute pressure accuracy (temperature range -40 .. +125c) p = 0 .. 10 bar p = 0 .. 20 bar p = 0 .. 30 bar -200 -250 -750 +500 +500 +500 mbar 2 long-term stability 6 months 50 mbar 3 maximum error over supply voltage vdd = 2.2 .. 3.6 v -40 +40 mbar notes 1) a stable pressure reading of the given resolutio n requires taking the average of 2 to 4 subsequent pressure values due to noise of the adc. 2) maximum error of pressure reading over the press ure range. 3) the long-term stability is measured with non-sol dered devices. temperature output characteristics this temperature information is not required for mo st applications, but it is necessary to allow for t emperature compensation of the pressure output. (vdd = 3.0 v unless noted otherwise) parameter conditions min typ max unit notes resolution 0.005 0.01 0.015 c t = 20c -0.8 0.8 c accuracy t = -40 .. +125c -4 +6 c 1 maximum error over supply voltage vdd = 2.2 .. 3.6 v -0.2 0.2 c note 1) with the second-order temperature compensation a s described in section ?function". see next section for typical operating curves.
da5535-30c_001.doc march 3rd, 2009 6 000055351474 ecn1199 typical performance curves adc-value d2 vs temperature (typical) 15000 20000 25000 30000 35000 40000 45000 -40 -20 0 20 40 60 80 100 120 temperature (c) adc-value d2 (lsb) adc-value d1 vs pressure (typical) 10000 15000 20000 25000 30000 0 5000 10000 15000 20000 25000 30000 pressure (mbar) adc-value d1 (lsb) -40c 25c 125c
da5535-30c_001.doc march 3rd, 2009 7 000055351474 ecn1199 absolute pressure accuracy after calibration, 1st o rder compensation -200 -100 0 100 200 300 400 500 600 0 5000 10000 15000 20000 25000 30000 pressure (mbar) pressure error (mbar) 125c 85c 60c 25c 0c -40c absolute pressure accuracy after calibration, 2nd o rder compensation -500 -400 -300 -200 -100 0 100 200 0 5000 10000 15000 20000 25000 30000 pressure (mbar) pressure error (mbar) 125c 85c 60c 25c 0c -40c
da5535-30c_001.doc march 3rd, 2009 8 000055351474 ecn1199 pressure error accuracy vs temperature (typical) -200 -150 -100 -50 0 50 100 150 200 250 -40 -20 0 20 40 60 80 100 120 temperature (c) pressure error (mbar) pres. error 10bar (1st order) pres. error 10bar (2nd order) temperature error accuracy vs temperature (typical) -5 0 5 10 15 -40 -20 0 20 40 60 80 100 120 temperature (c) temperature error (c) temperature error (standard calculation) temperature error (with 2nd order calculation)
da5535-30c_001.doc march 3rd, 2009 9 000055351474 ecn1199 pressure error vs supply voltage (typical) -25 -20 -15 -10 -5 0 5 10 15 20 25 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 voltage (v) pressure error (mbar) 30000 mbar 15000 mbar 2500 mbar temperature error vs supply voltage (typical) -0.15 -0.1 -0.05 0 0.05 0.1 0.15 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 voltage (v) temperature error (c)
da5535-30c_001.doc march 3rd, 2009 10 000055351474 ecn1199 function general the MS5535-30C consists of a piezoresistive sensor and a sensor interface ic. the main function of the MS5535-30C is to convert the uncompensated analogue output voltage from the piezoresistive pressure se nsor into a 16-bit digital value, as well as providing a 16-bit digital value for the temperature of the se nsor. ? measured pressure (16-bit) ?d1? ? measured temperature (16-bit) ?d2? as the output voltage of a pressure sensor is stron gly dependent on temperature and process tolerances , it is necessary to compensate for these effects. this com pensation procedure must be performed by software u sing an external microcontroller. for both pressure and temperature measurement the s ame adc is used (sigma delta converter): ? for the pressure measurement, the differential out put voltage from the pressure sensor is converted ? for the temperature measurement, the sensor bridge resistor is sensed and converted during both measurements the sensor will only be sw itched on for a very short time in order to reduce power consumption. as both, the bridge bias and the refer ence voltage for the adc are derived from vdd, the digital output data is independent of the supply vo ltage. factory calibration every module is individually factory calibrated at two temperatures and two pressures. as a result, 6 coefficients necessary to compensate for process variations and temperature variations are calculated and stored in the 64- bit prom of each module. these 64-bit (partitioned into four words of 16-bit) must be read by the microcontroller software and used in the program co nverting d1 and d2 into compensated pressure and temperature values. pressure and temperature measurement the sequence of reading pressure and temperature as well as of performing the software compensation is depicted in fig. 3 and fig. 5. first the word1 to word4 have to be read through th e serial interface. this can be done once after res et of the microcontroller that interfaces to the MS5535-30C. next the compensation coefficients c1 to c6 are ext racted using bit-wise logical- and shift-operations (refer to fig. 4 for the bit-pattern of word1 to word4). for the pressure measurement the microcontroller ha s to read the 16 bit values for pressure (d1) and temperature (d2) via the serial interface in a loop (for instance every second). then, the compensated pressure is calculated out of d1, d2 and c1 to c6 according to the algorithm in fig. 3 (possibly using quadrati c temperature compensation according to fig. 5). all calculations can be performed with signed 16-bit va riables. results of multiplications may be up to 32-bit long (+sign). in the flow according to fig. 3 each mult iplication is followed by a division. this division can be perfor med by bit-wise shifting (divisors are to the power of 2). it is ensured that the results of these divisions are les s than 65536 (16-bit). for the timing of signals to read out word1 to word 4, d1, and d2 please refer to the paragraph ?serial interface?. sensor d1 d2 word1..4 calculation in external micro- controller pressure temperature
da5535-30c_001.doc march 3rd, 2009 11 000055351474 ecn1199 system initialisation pressure and temperature measurement example: word1, word2, word3 and word4 (4x16 bit) d1 = 15380 d2 = 22027 start convert calibration data into coefficients: (see bit pattern of word1-word4) read calibration data (factory calibrated) from prom of ms5535-30 read digital pressure value from ms5535-30 d1 (16 bit) read digital temperature value from ms5535-30 display pressure and temperature value basic equations: calculate calibration temperature ut1=8*c5+10000 calculate temperature compensated pressure difference between actual temperature and reference temperature: dt = d2 - ut1 actual temperature: temp = 200 + dt*(c6+100)/2 11 (0.1c) resolution) calculate actual temperature d2 (16 bit) senst1 offt1 tcs tco t ref tempsens c1: pressure sensitivity (13 bit) c2: pressure offset (13 bit) c3: temperature coefficient of pressure sensitivity (10 bit) c4: temperature coefficient of pressure offset (9 b it) c5: reference temperature (12 bit) c6: temperature coefficient of the temperature (7 b it) word1 = 46076 word2 = 14170 word3 = 39937 word4 = 33721 c1 = 5759 c2 = 4317 c3 = 624 c4 = 263 c5 = 1665 c6 = 57 dt(d2) = d2 - t ref temp(d2)=20+dt(d2)*tempsens offset at actual temperature: off = c2 + ((c4-250)*dt)/2 12 + 10000 sensitivity at actual temperature: sens = c1/2 + ((c3+200)*dt)/2 13 + 3000 temperature compensated pressure in mbar: p = (sens * (d1-off))/2 11 + 1000 off(d2)=offt1+tco*dt(d2) sens(d2)=senst1+tcs*dt(d2) p(d1,d2)=d1*sens(d2)-off(d2) dt = -1293 temp = 101 = 10.1 c off = 14312 sens = 5749 p = 3998 = 3998 mbar ut1 = 23320 fig. 3: flow chart for pressure and temperature rea ding and software compensation. notes 1) readings of d2 can be done less frequently, but the display will be less stable in this case. 2) for a stable display of 0.1 mbar resolution, it is recommended to display the average of 8 subseque nt pressure values.
da5535-30c_001.doc march 3rd, 2009 12 000055351474 ecn1199 c1 (13 bit) c2/i (3 bit) word1 db12 db11 db10 db9 db8 db7 db6 db5 db4 db3 db2 db1 db0 db12 db11 db10 c2/ii (10 bit) c5/i (6 bit) word2 db9 db8 db7 db6 db5 db4 db3 db2 db1 db0 db11 db10 d b9 db8 db7 db6 c3 (10 bit) c5/ii (6 bit) word3 db9 db8 db7 db6 db5 db4 db3 db2 db1 db0 db5 db4 db3 db2 db1 db0 c4 (9 bit) c6 (7 bit) word4 db8 db7 db6 db5 db4 db3 db2 db1 db0 db6 db5 db4 db3 db2 db1 db0 fig. 4: arrangement (bit-pattern) of calibration da ta in word1 to word4. second-order temperature compensation in order to obtain best accuracy over the whole tem perature range, it is recommended to compensate for the non-linearity of the output of the temperature sens or. this can be achieved by correcting the calculat ed temperature and pressure by a second order correcti on factor. the second-order factors are calculated as follows: high temperatures dt2 = dt ? (dt/128*dt/128)/8 dt < 0 yes calculate temperature temp = (200 + dt2*(c6+100)/2 11 ) (0.1c) low temperatures dt2 = dt ? (dt/128*dt/128)/2 dt 0 yes fig. 5: flow chart for calculating the temperature and pressure to the optimum accuracy.
da5535-30c_001.doc march 3rd, 2009 13 000055351474 ecn1199 serial interface the MS5535-30C communicates with microprocessors an d other digital systems via a 3-wire synchronous se rial interface as shown in fig. 1. the sclk (serial cloc k) signal initiates the communication and synchroni ses the data transfer with each bit being sampled by the ms 5535-30c on the rising edge of sclk and each bit be ing sent by the MS5535-30C on the rising edge of sclk. the data should thus be sampled by the microcontrol ler on the falling edge of sclk and sent to the MS5535-30C with the falling edge of sclk. the sclk-signal is generated by the microprocessor?s system. the digit al data provided by the MS5535-30C on the dout pin is either the conversion result or the software calibr ation data. in addition the signal dout (data out) is also used to indicate the conversion status (conversion-ready signal, see below). the selection of the output da ta is done by sending the corresponding instruction on the pin din (data input). following is a list of possible output data instruc tions: ? conversion start for pressure measurement and adc- data-out ?d1? (figure 6a) ? conversion start for temperature measurement and a dc-data-out ?d2? (figure 6b) ? calibration data read-out sequence for word1 (fi gure 6c) ? calibration data read-out sequence for word2 (fi gure 6d) ? calibration data read-out sequence for word3 (fig ure 6c) ? calibration data read-out sequence for word4 (fig ure 6d) ? reset sequence (figure 6e) every communication starts with an instruction sequ ence at pin din. fig. 6 shows the timing diagrams f or the MS5535-30C. the device does not need a ?chip select ? signal. instead there is a start sequence (3-bit high) before each setup sequence and stop sequence (3-bit low) after each setup sequence. the setup sequence consists in 4-bit that select a reading of pressure, temperature or calibration data. in case of pressure- (d1) or temperature- (d2) reading the module acknow ledges the start of a conversion by a low to high t ransition at pin dout. two additional clocks at sclk are required after th e acknowledge signal. then sclk is to be held low b y the microcontroller until a high to low transition on d out indicates the end of the conversion. this signal can be used to create an interrupt in t he microcontroller. the microcontroller may now rea d out the 16-bit word by giving another 17 clocks on the slck pin. it is possible to interrupt the data readout sequence with a hold of the sclk signal. it is important to always read out the last convers ion result before starting a new conversion. the reset sequence is special as its unique pattern is recognised by the module in any state. by conse quence it can be used to restart if synchronisation betwee n the microcontroller and the MS5535-30C has been l ost. this sequence is 21-bit long. the dout signal might chan ge during that sequence (see fig. 6e). it is recomm ended to send the reset sequence before first conversion sequence to avoid hanging up the protocol permanent ly in case of electrical interference. sequence: start+p-measurement sclk dout din bit7 conversion start for pressure measurement and adc- data-out "d1": end of conversion bit6 bit5 bit4 bit3 bit2 bit1 bit0 conversion (33ms) db7 adc-data out msb adc-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 start of conversion setup-bits fig. 6a: d1 acquisition sequence.
da5535-30c_001.doc march 3rd, 2009 14 000055351474 ecn1199 sequence: start+t-measurement sclk dout din bit7 conversion start for temperature measurement and a dc-data-out "d2": end of conversion bit6 bit5 bit4 bit3 bit2 bit1 bit0 conversion (33ms) bit8 bit9 start-bit stop-bit setup-bits start of conversion db7 adc-data out msb adc-data out lsb db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 fig. 6b: d2 acquisition sequence. sequence: coefficient read + address sclk dout din bit7 calibration data read out sequence for word 1/ wor d 3: bit6 bit5 bit4 bit3 bit2 bit1 bit0 db7 coefficient-data out msb coefficient-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 bit10 bit11 address word 1 address word 3 setup-bits fig. 6c: word1, word3 reading sequence. address word 2 address word 4 sequence: coefficient read + address sclk dout din bit7 calibration data read out sequence for word 2/ wor d 4: bit6 bit5 bit4 bit3 bit2 bit1 bit0 db7 coefficient-data out msb coefficient-data out lsb bit8 bit9 start-bit stop-bit db6 db5 db4 db3 db2 db1 db0 db7 db6 db5 db4 db3 db2 db1 db0 bit10 bit11 setup-bits fig. 6d: word2, word 4 reading seque nce. sequence: reset sclk dout din bit7 reset - sequence: bit6 bit5 bit4 bit3 bit2 bit1 bit0 bit8 bit9 bit10 bit11bit12 bit13 bit14 bit15 fig. 6e: reset sequence (21-bit).
da5535-30c_001.doc march 3rd, 2009 15 000055351474 ecn1199 application information general the advantage of combining a pressure sensor with a directly adapted integrated circuit is to save oth er external components and to achieve very low power consumptio n. the main application field for this system inclu des portable devices with battery supply, but its high accuracy and resolution make it also suited for ind ustrial and automotive applications. the possibility to compens ate the sensor with software allows the user to ada pt it to his particular application. communication between the m s5535-30c and the widely available microcontrollers is realised over an easy-to-use 3-wire serial interfac e. customers may select which microcontroller syste m to be used, and there are no specific standard interface cells required, which may be of interest for specia lly designed 4 bit-microcontroller applications. calibration the MS5535-30C is factory calibrated. the calibrati on data is stored inside the 64-bit prom memory. soldering please refer to the application note an808 for all soldering issues. humidity, water protection the silicon pressure transducer and the bonding wir es are protected by an anticorrosive and antimagnet ic protection cap. the MS5535-30C carries a metal prot ection cap filled with silicone gel for enhanced pr otection against humidity. the properties of this gel ensure function of the sensor even when in direct water c ontact. this feature can be useful for waterproof watches or oth er applications, where direct water contact cannot be avoided. nevertheless the user should avoid drying of hard materials like for example salt particles o n the silicone gel surface. in this case it is better to rinse with clean water afterwards. special care has to be taken to not mechanically damage the gel. damaged gel could lead to air entrapment and consequently to unstable sensor signal, especially if the damage is close to the sensor surface. the metal protection cap is fabricated of special a nticorrosive and antimagnetic stainless steel in or der to avoid any corrosive battery effects inside the final prod uct. for underwater operations it is important to seal t he sensor with a rubber o-ring around the metal rin g. any salt water coming to the contact side (ceramic and pads) of the sensor could lead to permanent damage. light sensitivity the standard version of MS5535-30C is protected aga inst sunlight by a layer of white gel. it is, howev er, important to note that the sensor may still be slig htly sensitive to sunlight, especially to infrared light sources. this is due to the strong photo effect of silicon. as the effect is reversible there will be no damage , but the user has to take care that in the final product the sens or cannot be exposed to direct light during operati on. this can be achieved for instance by placing mechanical part s with holes in such that light cannot pass. connection to pcb for "under water" devices it is necessary to provid e a stable mechanical pusher from the backside of t he sensor. otherwise the overpressure might push the sensor ba ckwards and even bend the electronic board on which the sensor is mounted. for applications subjected to me chanical shock, it is recommended to enhance the mechanical reliability of the solder junctions by c overing the rim or the corners of MS5535-30C's cera mic substrate with glue or globtop like material. decoupling capacitor particular care must be taken when connecting the d evice to power supply. a 47 f tantalum capacitor must be placed as close as possible of the MS5535-30C's vdd pin. this capacitor will stabilise the power suppl y during data conversion and thus, provide the highest possi ble accuracy.
da5535-30c_001.doc march 3rd, 2009 16 000055351474 ecn1199 application example: diving computer system using m s5535-30c MS5535-30C is a circuit that can be used in connect ion with a microcontroller in diving computer appli cations. it is designed for low-voltage systems with a supply v oltage of 3 v, particularly in battery applications . the ms5535- 30c is optimised for low current consumption as the ad-converter clock (mclk) can use the 32.768 khz frequency of a standard watch crystal, which is sup plied in most portable watch systems. 4/8bit-microcontroller lcd-display eeprom keypad ms5535-30 sclk din dout mclk xtal1 xtal2 32.768 khz optional vdd gnd vdd gnd 3v-battery 47f tantal figure 7: demonstration of MS5535-30C in a diving c omputer.
da5535-30c_001.doc march 3rd, 2009 17 000055351474 ecn1199 device package outlines fig. 8: device package outlines of MS5535-30Cm .
da5535-30c_001.doc march 3rd, 2009 18 000055351474 ecn1199 recommended pad layout pad layout for bottom side of MS5535-30C soldered o nto printed circuit board fig. 9: layout for bottom side pad layout for top side of MS5535-30C soldered onto printed circuit board fig. 10: layout for top side
da5535-30c_001.doc march 3rd, 2009 19 000055351474 ecn1199 assembly mechanical stress it is recommended to avoid mechanical stress on the pcb on which the sensor is mounted. the thickness of the pcb should be not below 1.6 mm. a thicker pcb is st iffer creating less stress on the soldering contact s. for applications where mechanical stress cannot be avoi ded (for example ultrasound welding of the case or thin pcb?s in diving computer) please fix the sensor wit h drops of low stress epoxy (for example hysol fp-4 401) at the corners of the sensor as shown below. fixing with globtop increases mechanical stability mounting the MS5535-30C can be placed with automatic pick&pl ace equipment using vacuum nozzles. it will not be damaged by the vacuum. due to the low stress assemb ly the sensor does not show pressure hysteresis eff ects. special care has to be taken to not touch the prote ctive gel of the sensor during the assembly. the MS5535-30C can be mounted with the cap down or the cap looking upwards. in both cases it is import ant to solder all contact pads. the pins pen and pv shall be left open or connected to vdd. do not connect the pins pen and pv to gnd! placement cap down (hole in pcb to fit cap) solder at both sides to increase mechanical stability placement cap up sealing with o-ring in products like diving computer the electronics must be protected a gainst direct water or humidity. for those products the MS5535-30Cm provides the possibility t o seal with an o-ring. the protective cap of the ms 5535- 30cm is made of special anticorrosive stainless ste el with a polished surface. in addition to this the ms5535- 30cm is filled with silicone gel covering the senso r and the bonding wires. the o-ring (or o-rings) sh all be placed at the outer diameter of the metal cap. this method avoids mechanical stress because the sensor can move in vertical direction.
da5535-30c_001.doc march 3rd, 2009 20 000055351474 ecn1199 cleaning the MS5535-30C has been manufactured under cleanroo m conditions. each device has been inspected for th e homogeneity and the cleanness of the silicone gel. it is therefore recommended to assemble the sensor under class 10?000 or better conditions. should this not be possible, it is recommended to protect the senso r opening during assembly from entering particles and dust. t o avoid cleaning of the pcb, solder paste of type ? no-clean? shall be used. cleaning might damage the sensor! esd precautions the electrical contact pads are protected against e sd according to 4 kv hbm (human body model). it is therefore essential to ground machines and personal properly during assembly and handling of the devic e. the MS5535-30C is shipped in antistatic transport boxes . any test adapters or production transport boxes u sed during the assembly of the sensor shall be of an eq uivalent antistatic material.
da5535-30c_001.doc march 3rd, 2009 21 000055351474 ecn1199 ordering information product code product art.-nr. package comments MS5535-30Cm 30 bar pressure sensor module with gel 325535010 smd hybrid with solder paste, metal protection cap, silicon gel sensor protection standard version factory contacts intersema sensoric sa ch. chapons-des-prs 11 ch-2022 bevaix switzerland tel. 032 847 9550 tel. int. +41 32 847 9550 telefax +41 32 847 9569 e-mail: http://www.intersema.ch notice intersema reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. intersema assumes no responsibility for the use of any circu its shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes n o claim that the circuits are free from patent infringement. applications for any devices s hown in this data sheet are for illustration only a nd intersema makes no claim or warranty that such applications will be suitable fo r the use specified without further testing or modi fication.

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